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VSMY7850X01
www.vishay.com
SOLDER PROFILE
300
Vishay Semiconductors
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
250
255 °C
240 °C
217 °C
max. 26 0 °C
245 °C
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
200
150
100
max. 120 s
max. 30 s
max. 100 s
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 4 weeks
Conditions: T amb < 30 °C, RH < 60 %
50
0
max. ramp up 3 °C/s max. ramp down 6 °C/s
Moisture sensitivity level 2a, acc. to J-STD-020B
DRYING
0
50
100
150
200
250
300
In case of moisture absorption devices should be baked
19841
Time (s)
before soldering. Conditions see J-STD-020 or label.
Fig. 7 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 for
Preconditioning acc. to JEDEC, Level 2a
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
Rev. 1.3, 02-May-13
6
Document Number: 81145
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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